Abstract: Passive thermal management systems can prevent the temperature of electron devices inside the logging tool from exceeding the tolerance during operating hours. The excellent insulation performance of thermal management systems makes the logging tool take relative long time to cool down for the next operation. Therefore, a room-temperature cooling solution for the logging tool was proposed, achieving rapid cooling by withdrawing the circuit skeleton from the thermos bottle and releasing it into the air. A chip protective shell was set up to avoid direct contact between the internal electron devices and the air, and thus the logging tool could achieve rapid cooling while avoiding the thermal stress caused by the high-temperature difference and the damage to the internal electron devices by water vapor liquefaction. The simulation and experiment verified the feasibility of the scheme. At the same time, the influence of different factors on the effect of cooling schemes was simulated, and the best cooling scheme was determined. The results demonstrate that the proposed room temperature cooling scheme effectively addresses the cooling and heat dissipation challenges in passive thermal management systems for logging tools, thereby enhancing working efficiency.